Jaipur, Rajasthan, India
Information Technology
Other
CoreEl Technologies
Overview
Location:
- Bangalore
Education:
- B.E./B.Tech. in Mechanical, M.E/ M.Tech. Mechanical
Experience:
- 10+ Years
Professional Skills:
Roles and Responsibility:
Mandatory Skill Set:
Desired Skill Set:
- Minimum 10 years’ experience in designing Air cooled and conduction cooled electromechanical Enclosures and Chassis for defense/Avionics/Telecom industry.
- Experience in milled, sheet metal and plastic enclosure designs.
- Knowledge in 19-inch rack, ATR, VPX, JSS55555, DO-160, VME and ATCA standards.
- 10-years’ experience in Solid works / any design and drafting tools
- Knowledge of Structural and Thermal analysis.
- Ability to manage 2-member team
- As a Mechanical Engineer- Electronics Packaging specialist, you will be responsible for developing portions of the lithography system and/or associated tooling related to the electronics infrastructure.
- The position requires highly motivated, extremely organized and self-driven individuals. As a Mechanical Engineer- Electronics Packaging Specialist will:
- Perform mechanical design and development associated with packaging electronic circuits including, assembly design, analysis, test, and manufacturing introduction support for both new and existing electronics design projects.
- Understand and mitigate possible failure mechanisms associated with materials, interconnects, and environmental loads to develop a reliable design.
- Communicate with a team of multi-disciplined engineers (Systems , Electrical, Mechanical, Manufacturing, New Product Logistics, and Product Information Management) for design and logistic release approval.
- Investigate and edit product structures, generate CAD models, 2D/3D drawings and be responsible for the final technical data package.
- Create, edit, review, and drive Engineering Changes to closure.
Roles and Responsibility:
- Ability to take up mechanical design independently.
- Interact with customers and project team, capture input and design accordingly.
- Design the components to meet DFM and DFA and customer requirement.
- Should be a team player.
- Ability to manage 2-member team.
Mandatory Skill Set:
- Minimum10 years’ experience in designing Air cooled and conduction cooled electromechanical Enclosures and Chassis for defense/Telecom industry.
- Proficiency in Solid works and AutoCAD.
- Good knowledge about BOM creation, material selection, Fastener selection, CNC machining and surface finish process.
- Vendor development activities.
Desired Skill Set:
- Knowledge in Structural and Thermal analysis.
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