Bangalore, Karnataka, India
Information Technology
Full-Time
CoreEL Technologies
Overview
: Technical Lead Mechanical
Location: Bangalore
Education: B.E./B.Tech. in Mechanical, M.E/ M.Tech. Mechanical
Experience: 10 Years
Professional Skills
Location: Bangalore
Education: B.E./B.Tech. in Mechanical, M.E/ M.Tech. Mechanical
Experience: 10 Years
Professional Skills
- Minimum 10 years experience in designing air-cooled and conduction-cooled electromechanical enclosures and chassis for the defense/Avionics/Telecom industry.
- Experience in milled, sheet metal, and plastic enclosure designs.
- Knowledge in 19-inch rack, ATR, VPX, JSS55555, DO-160, VME, and ATCA standards.
- 10 years experience in SolidWorks / any design and drafting tools.
- Knowledge of Structural and Thermal analysis.
- Ability to manage a 2-member team.
- As a Mechanical Engineer - Electronics Packaging Specialist, you will be responsible for developing portions of the lithography system and/or associated tooling related to the electronics infrastructure.
- The position requires highly motivated, extremely organized, and self-driven individuals. As a Mechanical Engineer - Electronics Packaging Specialist will:
- Perform mechanical design and development associated with packaging electronic circuits including assembly design, analysis, test, and manufacturing introduction support for both new and existing electronics design projects.
- Understand and mitigate possible failure mechanisms associated with materials, interconnects, and environmental loads to develop a reliable design.
- Communicate with a team of multi-disciplined engineers (Systems, Electrical, Mechanical, Manufacturing, New Product Logistics, and Product Information Management) for design and logistic release approval.
- Investigate and edit product structures, generate CAD models, 2D/3D drawings, and be responsible for the final technical data package.
- Create, edit, review, and drive Engineering Changes to closure.
- Self-Check and Peer-Check department designs and change notifications.
- Ability to take up mechanical design independently.
- Interact with customers and project team, capture input and design accordingly.
- Design the components to meet DFM and DFA and customer requirements.
- Should be a team player.
- Ability to manage a 2-member team.
- Minimum 10 years experience in designing air-cooled and conduction-cooled electromechanical enclosures and chassis for the defense/Telecom industry.
- Proficiency in SolidWorks and AutoCAD.
- Good knowledge about BOM creation, material selection, fastener selection, CNC machining, and surface finish process.
- Vendor development activities.
- Knowledge in Structural and Thermal analysis.
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